Flexible Vertical Light Emitting Diodes

1. Rak-Hwan Kim⁴, 
2. Stanley Kim⁴, 
3. Young Min Song⁴, 
4. Hyejin Jeong⁵, 
5. Tae-il Kim⁴, 
6. Jongho Lee³, 
7. Xuling Li², 
8. Kent D. Choquette², 
9. John A. Rogers^1,*

Article first published online: 13 AUG 2012

DOI: 10.1002/smll.201201195

Strategies are presented to achieve ultrathin light-emitting diodes using the technique of epitaxial liftoff in ways that protect the materials from the etchants used for release and tether the devices to the underlying wafer for subsequent transfer printing onto substrates of interest. The results lead to an advanced interconnection scheme and vertical device layout that facilitate electrical contacts and system integration on flexible substrates.